In-Mould Electronics (IME), also known as plastronics, is used to enhance the device integration process, increasing resistance to humidity and wear and tear, and adding custom-made connectors. IME will also serve as a manufacturing process for the advanced materials with better conductive and resistant properties proposed in the project.
This technology allows to create plastronic products combining electronics’ functional printing and electronic components’ hybridisation with traditional plastic transformation processes, such as thermoforming and injection moulding.
IME brings a wide variety of advantages in comparison to traditional manufacturing processes, like increased functionality or more durable electronics, as they are protected and embedded. It also eases automation, as those conventional processes are replaced with a single part that does not require any assembly during production. Additionally, the complexity of plastic products is reduced, thickness and weight are lowered, and electronics are integrated in products that have geometrically complex 3D shapes.
In Mould Electronics (IME) will be validated as a high-speed and competitive manufacturing methodology, building up on an already established mass production technology as plastic injection.
The objective of this Workshop is the development of two CEN Workshop Agreement on Hybridization, Thermoforming and Injection moulding of rigid control units on in-mould flexible devices process and one CEN Workshop Agreement on the effect of material choice and plastic insertion on the design of antennas by simulation and material choice for in-mould tags.
The kick-off meeting will be held on 2nd November 2022, from 10:00 to 14:00 as online meeting. People interested to participate in the kick-off meeting can register through the form below.
All interested parties are invited to submit comments on the draft Project Plan using the commenting form below, to the Workshop secretary, Francisco Luis ARRIBAS MARTIN by e-mail to (farribas@une.org) by 1 November 2022.
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